IC Package Process Engineer, Dojo

Job Description

In this role, you will oversee the assembly process for advanced IC packaging, including development and high-volume manufacturing. You will lead packaging assembly process integration, explore semiconductor packaging technology development, and work with OSAT vendors to bring advanced packaging solutions from concept to production.

Requirements

• Bachelor’s Degree in a relevant field
• 2+ years experience in semiconductor packaging technology
• Expert knowledge in 2D/2.5D/3D packaging technology
• Solid experience in advanced packaging assembly processes
• Excellent problem-solving and communication skills
• Optical module integration experience is a plus.

Responsibilities

• Collaborate with cross-functional groups
• Lead SoC packaging assembly process integration
• Drive advanced semiconductor packaging technology development
• Work with OSAT vendors
• Ensure high-volume manufacturing.

Benefits

• Benefits include Aetna PPO and HSA plans with $0 payroll deduction, family-building benefits, dental and vision plans with $0 contribution, flexible spending accounts, 401(k) with employer match, company-paid life insurance, sick and vacation time, and employee discounts.