IC Package Layout Engineer

Job Description

The Dojo & Self-Driving Hardware teams are looking for an Engineer to design IC Packages, contributing to the next generation of Self-Driving Hardware and Dojo Super AI Computer. You will work closely with IC package process, SI/PI, thermal/mechanical, and PCB layout teams and interface with vendors. This role requires a strong growth mindset and versatility in a dynamic environment.

Requirements

• Engineering Degree or equivalent
• 2+ years of hands-on experience with flip chip IC package design
• Proficient in Cadence APD+ and SiP Layout
• Familiar with Unix, Python, TCL, MATLAB
• Basic transmission line theory and signal/power integrity fundamentals.

Responsibilities

• Design layer stackup, constraints, layout optimization
• Conduct feasibility studies, review die floor plan and mockup design
• Perform DRC/DFM checks and LVS checks based on netlist and schematic.

Benefits

• Benefits include Aetna PPO and HSA plans with $0 payroll deduction, family-building benefits, dental and vision plans with $0 contribution, flexible spending accounts, 401(k) with employer match, company-paid life insurance, sick and vacation time, and employee discounts.