IC Packaging Engineer – WLP

Job Description

Apple is seeking a hardworking IC Packaging Engineer to lead packaging technology development including advanced 2.5D/3D packaging.

Requirements

• BS in relevant field
• 3+ years of industry experience
• Experience in Semiconductor Packaging field
• Knowledge of materials characterization and analysis
• Understanding of Wafer Level Packaging, 2.5D, and 3D packaging technology
• Strong interpersonal skills and ability to collaborate with multi-functional teams
• Proficiency in package design software
• General understanding of packaging technologies, assembly processes, IC packaging materials, and reliability standards

Responsibilities

• Lead packaging technology development
• Work with multi-functional team on SoC Package integration efforts
• Innovate Package Architecture and Integration
• Collaborate with foundry and OSAT for packaging solutions
• Drive industry with sophisticated Package solutions and new material development
• Manage projects independently with minimum supervision