IC Package Design Engineer

Job Description

The IC Package Design Engineer at Apple will be responsible for implementing the physical design of packages and modules for various chips, working with multi-functional teams, and driving innovation in package design.

Requirements

• BS in a relevant field
• 3+ years of industry experience
• Fundamental knowledge in electrical/material/thermal/mechanical engineering
• Proficiency in Cadence Allegro platform tools or Mentor Xpedition platform tools
• Understanding of SI/PI tools, package model extraction, and substrate manufacturing process
• Knowledge of high-speed interfaces like DDR, PCIe, NAND
• Experience in Unix environment and scripting languages

Responsibilities

• Implement physical design of packages and modules for SoC, Memory, RF, and cellular chips
• Coordinate with multi-functional groups for new product package feasibility analysis and selection
• Develop design verification and automation strategy for package design
• Optimize package pin out and ensure SI/PI requirements are met
• Drive methodology and efficiency improvements in package design
• Explore and evaluate new CAD tools and design flows
• Partner with Silicon PD team to optimize chip Floorplan and bump placement