IC Package Design Engineer

Apple Inc.

3/14/2025

Irvine, CA

Full-time

Salary: $166,600 - $296,300 per year

Job Description

The IC Package Design Engineer position at Apple involves implementing the physical design of packages and modules for various chips, optimizing package performance, and driving efficiency improvements in package design.

Requirements

BS in relevant field
10+ years of industry experience
Fundamental knowledge in electrical/material/thermal/mechanical engineering
Proficiency in Cadence Allegro or Mentor Xpedition platform tools
Understanding of SI/PI tools and package model extraction
Basic knowledge of substrate manufacturing process and high-speed interfaces
Experience in Unix environment and scripting languages
Familiarity with CAM350/Valor or Calibre and CAD

Responsibilities

Implement physical design of packages and modules for SoC, Memory, RF, and cellular chips
Coordinate with multi-functional groups on product package feasibility analysis and design
Develop design verification and automation strategy for package design
Optimize package pin out and perform extraction of S-parameters and package RLGC model
Ensure package design meets SI/PI requirements and drive efficiency improvements
Explore and develop new CAD tools and verification flows
Partner with Silicon PD team to optimize chip Floorplan and bump placement