Technical Program & Quality Manager (System-in-Package)

Job Description

Seeking a seasoned Technical Program Management (TPM) and Quality professional with experience in semiconductor packaging or electronic assembly processes for a pivotal role within the DFM organization at Apple.

Requirements

• 7+ years of experience in semiconductor packaging or electronic assembly processes including SMT, underfill/mold, laser, PVD/coating, bending, testing, and related technologies
• Bachelor's or Master's degree in Mechanical Engineering, EE, Material Science, or related field

Responsibilities

• Partner with manufacturing suppliers and cross-functional teams to optimize product design and process for manufacturability
• Develop and implement factory and quality control systems to ensure high product quality standards
• Serve as key contact during factory or quality excursions, providing clear communication to management, teams, and suppliers
• Identify, address, and prevent critical issues while driving continuous improvement in factory operations and product quality