Display Module Assembly and Packaging Engineer

Job Description

Apple is seeking a hardworking and experienced Engineer to join the display module team, focusing on display hardware development and validation for the next generation Apple product.

Requirements

• BS with 10+ years of semiconductor packaging/assembly experience
• M.S or Ph.D. in Mechanical Engineering, Physics, Materials Science, Electrical Engineering or similar fields
• Prior optical packaging experience with camera/CMOS image sensor module, LED, photodiode and optical component integrations and system interactions
• Solid fundamentals in electrical/material/thermal/mechanical engineering field
• Familiarity with various sophisticated package configurations and assembly / substrate technology
• Experience with TSV, 2D/2.5D and 3D package connection
• Substrate manufacturing process, structure, design rules and material property

Responsibilities

• Own overall mechanical and module master specifications from initial concept to mass production
• Define new display optical package special characteristics based on unique module and system level performance, cost, and footprint requirements
• Define and develop a MP assembly process
• Lead multi-functional teams, collaborate with key stakeholders to iterate the design
• Identify and assess critical metrics affecting display performance
• Ability to communicate effectively across the organization, manage risk, and make decisions with limited information